JPH0546702B2 - - Google Patents

Info

Publication number
JPH0546702B2
JPH0546702B2 JP59101208A JP10120884A JPH0546702B2 JP H0546702 B2 JPH0546702 B2 JP H0546702B2 JP 59101208 A JP59101208 A JP 59101208A JP 10120884 A JP10120884 A JP 10120884A JP H0546702 B2 JPH0546702 B2 JP H0546702B2
Authority
JP
Japan
Prior art keywords
base plate
case
semiconductor device
hole
reinforcing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP59101208A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60244051A (ja
Inventor
Toshiaki Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59101208A priority Critical patent/JPS60244051A/ja
Publication of JPS60244051A publication Critical patent/JPS60244051A/ja
Publication of JPH0546702B2 publication Critical patent/JPH0546702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59101208A 1984-05-17 1984-05-17 半導体装置 Granted JPS60244051A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59101208A JPS60244051A (ja) 1984-05-17 1984-05-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59101208A JPS60244051A (ja) 1984-05-17 1984-05-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS60244051A JPS60244051A (ja) 1985-12-03
JPH0546702B2 true JPH0546702B2 (en]) 1993-07-14

Family

ID=14294501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59101208A Granted JPS60244051A (ja) 1984-05-17 1984-05-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS60244051A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63208253A (ja) * 1987-02-25 1988-08-29 Toshiba Corp 半導体回路装置

Also Published As

Publication number Publication date
JPS60244051A (ja) 1985-12-03

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees